Wafer Polishing Terminology in Japanese244

The process of wafer polishing is a critical step in the semiconductor manufacturing process, and it requires a high level of precision and control. In order to achieve the desired results, it is important to have a clear understanding of the terminology used in this field.

The following are some of the most common Japanese words used in wafer polishing:* 研磨 (kenma): This refers to the process of removing material from the wafer surface in order to create a smooth and flat surface.
* 平坦化 (heitanka): This refers to the process of making the wafer surface as flat as possible.
* 鏡面研磨 (kyo-menkenma): This refers to the process of creating a mirror-like finish on the wafer surface.
* ラッピング (rappingu): This refers to the process of using a rotating abrasive wheel to remove material from the wafer surface.
* ポリッシング (porisshingu): This refers to the process of using a fine abrasive to create a smooth and glossy finish on the wafer surface.
* CMP (ケミカルメカニカルポリッシング): This refers to a process that uses a combination of chemical and mechanical action to remove material from the wafer surface.
* スラリー (surari): This refers to the liquid mixture used in the polishing process.
* 研磨パッド (kenma paddo): This refers to the material used to hold the abrasive and polish the wafer surface.
* 研磨ヘッド (kenma heddo): This refers to the device that holds the wafer and moves it across the polishing pad.
* 研磨圧力 (kenma atsuryoku): This refers to the pressure applied to the wafer during the polishing process.
* 研磨速度 (kenma sokudo): This refers to the speed at which the wafer is moved across the polishing pad.

In addition to the above terms, there are a number of other specialized terms used in wafer polishing. For a more comprehensive understanding of this field, it is recommended to consult a specialized dictionary or glossary.

Conclusion

Wafer polishing is a complex process that requires a high level of precision and control. In order to achieve the desired results, it is important to have a clear understanding of the terminology used in this field. The terms listed above are some of the most common Japanese words used in wafer polishing, and they provide a good foundation for understanding this important process.

2024-12-05

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